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.UPD780101
.UPD780102
.UPD780103
; U15836EJ5V0UD00

; MEMORY MAP
area DATA ROM      0x0000:0x6000   Internal ROM
area DATA RAM      0xFC00:0xFF00   Internal High-Speed RAM
area DATA SFR      0xFF00:0x10000  Special Function Register

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import sys
import os
import os.path
import math
from collections import namedtuple
# screw this
os.environ["OPENCV_IO_MAX_IMAGE_PIXELS"] = str(pow(2,40))
import cv2 as cv

PointBase = namedtuple("Point", ("x", "y", "z"), defaults=(0, 0, 0))

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NEC / Renesas MCUs

Distinct feature: pins RESET, XOUT, VSS, XIN, VDD go in a group, and accept a ceramic resonator.

M16C MCUs

Family	Packages	Doc.no.
M16C/1N	48P6Q-A	REJ09B0007
M16C/26	48P6Q	REU09B0001

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This is a list of procedures to perform in order to calibrate a FDM/FFF 3D printer.

Heaters PID constants

Perform this calibration to ensure the control algorithms for heating elements do the right job and do not overshoot/undershoot/oscillate.

This only needs to be done once per maintenance period.

1. Use the M303 E0 S to calibrate the hot end and save the reported values with M301 P I D.
2. Use the M303 E-1 S to calibrate the bed and save the reported values with M304 P I D.

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Total wires: 910

Options:

• RHD except AU, SG, HK
• w/ Built-in Amplifier
• w/ Navigation
• w/ Side Airbag
• w/ Front Fog Light
• w/ Rear Fog Light
• w/o Cold Area Spec

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The list below is compiled to inform, guide, and inspire budding security researchers. Oh and to pick something for bedtime reading too.

Included in the list are works on the following topics related to MCU/SoC security:

• Secure boot
• Fault injection
• Side channel attacks

At the end of the list, there is also a section with links to articles of potential general interest, not addressing vulnerabilities in any specific device.

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EESchema-LIBRARY Version 2.4
#encoding utf-8
#
# Generic_ONFI_NAND_LGA52
#
DEF Generic_ONFI_NAND_LGA52 U 0 40 Y Y 1 F N
F0 "U" 0 2650 50 H V L BNN
F1 "Generic_ONFI_NAND_LGA52" 0 -100 50 H V L BNN
F2 "Memory:LGA52C100P7X13_UNI" 0 0 50 H I L BNN
F3 "" 0 0 50 H I L BNN

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CUPL(WM)        5.0a  Serial# MW-10400000
Device          g22v10  Library DLIB-h-40-1
Created         Tue Jul 28 01:39:30 2020
Name            bug
Partno          NA
Revision        01
Date            22/04/2020
Designer        dj
Company         None

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import struct

class BetterStructMeta(type):
    def __new__(cls, clsname, superclasses, attributedict):
        if clsname != 'BetterStruct':
            fields = attributedict['__fields__']
            field_types = [ _[0] for _ in fields ]
            field_names = [ _[1] for _ in fields if _[1] is not None ]
            size = 0
            for fielddef in fields:

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eMMC reballing

The same technique should work well with other (bigger) ball sizes too, however there are rarely issues when handling bigger packages and less care is usually needed there.

The technique uses premade solder balls, not solder paste.

Equipment:

• Solder balls of correct size (0.3mm for eMMC)
• Stencil to hold the balls with correct configuration for the package eg eMMC 153/169 standard stencil